applications and lamination structures of solventless lamination

Solventless lamination, as the name suggests, involves using adhesive systems that do not require solvents for application. It has gained popularity in various packaging applications due to its environmental friendliness, cost-effectiveness, and improved performance over solvent-based alternatives. The suitability of solventless lamination depends on the adhesive's performance characteristics, which continue to evolve and improve over time.

Currently, solventless lamination is widely used in the following applications and lamination structures in China:

1. Dry light packaging: Examples include laminates like BOPP/CPP, BOPP/VMCPP, PET/CPP, BOPP/PE, BOPP/VMPET/PE, BOPP/VMBOPP, and similar combinations.

2. Boiling package: Solventless lamination finds application in laminates designed for boiling or high-temperature packaging. Typical examples are NY/PE, PET/PE, NY/CPP, PET/CPP, and similar structures.

3. Heavy packaging: Solventless laminates are suitable for heavy-duty packaging, such as rice bags. Examples include PET/PE, PP/PE, and similar combinations.

4. 121°C cooking: Solventless lamination can be used for laminates intended for cooking applications at high temperatures, such as NY/RCPP, PET/NY/RCPP, and similar structures.

It's important to note that the suitability of solventless lamination may vary depending on specific requirements, regulations, and advancements in adhesive technology. As adhesive properties continue to improve, the application range of solventless lamination is expected to expand further.

Please keep in mind that the information provided is based on the current understanding of solventless lamination in China and may not encompass all possible uses and lamination structures globally.